Zhiguang ZTE mobile phone chips grew against the trend, with a market share of 1
Unisoc's smartphone chip global market share reached 12% in 2023, increasing by 1 percentage point against the trend.
According to statistics from multiple research institutions, the global smartphone market underwent adjustments in 2023, with shipments estimated to be between 1.14 billion and 1.16 billion units, a year-on-year decline of 4%. However, against the backdrop of the lowest demand in the mobile phone market in a decade, UniSOC's smartphone chip global market share for 2023 reached 12%, increasing by 1 percentage point against the trend, with a growth rate better than the industry's main competitors.
Data shows that UniSOC's market share in the fourth quarter of 2023 reached 13%, with a shipment growth rate of 24%, making it the fastest-growing smartphone chip manufacturer in the open market in terms of year-on-year growth.
In 2023, MediaTek remained the leader in smartphone chips, maintaining the top position in shipments; Apple and Qualcomm ranked second and third, respectively.
Data from Canalys shows that MediaTek achieved a year-on-year growth of 21% in the fourth quarter of 2023, mainly thanks to the increase in shipments of smartphones from Samsung, Xiaomi, and vivo. The shipments of MediaTek Soc products adopted by these three smartphone manufacturers account for half of MediaTek's total smartphone Soc shipments.
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Benefiting from the growth of the smartphone business, MediaTek's revenue in the fourth quarter of 2023 was 129.562 billion New Taiwan dollars, an increase of 17.7% quarter-on-quarter and 19.7% year-on-year. In November 2023, MediaTek officially launched the Dimensity 9300, which was first equipped on the vivo X100 series.
After the launch of the Dimensity 9300, the industry witnessed a "Dimensity 9300 vs Snapdragon 8 Gen 3" battle, with various evaluations comparing the performance of the two Socs. In the Android mobile flagship chip lineup, the performance of the Dimensity 9300 can be described as powerful.
Analysts from the research institution Canalys stated that the recovery of emerging markets led to the rebound of the smartphone market in the second half of 2023, narrowing the global market decline, and the inventory pressure has been significantly reduced. Looking forward to 2024, emerging markets will continue to be a strategic priority for most mobile phone manufacturers seeking growth.In the first half of 2023, Unigroup's smartphone chip global market share reached 15%.
Global market research firm Counterpoint Research previously released a report on the global smartphone AP/SoC market for the second quarter of 2023. The report shows that Unigroup's smartphone chip global market share reached 15% in Q2 2023, making it the fastest-growing chip company in terms of quarterly growth.
According to Counterpoint Research's analysis, Unigroup's shipments achieved rapid growth in the second quarter of 2023. As the penetration rate of entry-level 5G smartphones increased in regions such as Latin America, Southeast Asia, the Middle East and Africa, and Europe, Unigroup also gained a certain market share in these areas.
As a world-leading platform chip design company, Unigroup is committed to providing high-value products and solutions for global customers and partners, making the intelligent world within reach. In the field of 5G, Unigroup has formed a complete chain in technology, products, solutions, terminal applications, and industry layout, and is fully expanding into overseas markets.
Unigroup's CEO, Ren Qiwei: 6G tests semiconductor innovation capabilities
What kind of demand does 6G have for semiconductors, and what challenges does it pose for semiconductor technological innovation? In the keynote speech at the opening of SEMICON CHINA on March 20, Ren Qiwei, Executive Vice President of Unigroup and CEO of Unigroup, said that over the past 40 years, the communication industry and the semiconductor industry have complemented each other. In 2030, six years from now, it not only carries the vision of the semiconductor industry's sales breaking through 100 billion US dollars but also marks the first year of 6G as defined by the ITU (International Telecommunication Union). This indicates that the relationship of mutual promotion and development between communication and semiconductors will continue to exist for a long time.
Before 5G, mobile communication was centered on communication. In the 6G era, communication networks will evolve into mobile information networks, achieving a great integration of communication, perception, computing, artificial intelligence, and the integration of air, land, and space. Ren Qiwei stated that 6G is a mobile information network that integrates perception, computation, and cognition, and integrates the sky and the earth.
Ren Qiwei pointed out that the demand for semiconductor technology in 6G is concentrated in four areas.
First is the process. The continuation of Moore's Law will promote innovation in semiconductor transistor architecture and processes. By expanding functions and integrating functions, the semiconductor industry can "extend Moore." In the future, with technological innovations such as tunnel field-effect transistors and spintronics, the semiconductor industry is expected to "go beyond Moore."Second, the chip architecture. With the improvement of design levels and processes, a single chip will integrate more modules to build more powerful system-on-chip (SoC). Advanced packaging technologies such as SiP (System in Package), Chiplet, and SMT (Surface-Mount Technology) will be further applied, allowing chips to integrate more heterogeneous functional components.
Third, RF components. As the communication frequency rapidly increases with the advent of 6G, the performance of ADC/DAC also needs to be significantly upgraded. Antenna integration and new materials are also important directions for driving the evolution of RF components.
Fourth, memory devices. On the one hand, 6G requires higher-density memory devices, such as high-density storage achieved through 3D stacking like HBM; on the other hand, emerging memory technologies like RRAM and MRAM will also find innovative application spaces in the era of 6G.
*Disclaimer: This article is the original creation of the author. The content of the article represents their personal views. Our reposting is solely for sharing and discussion and does not represent our approval or agreement. If you have any objections, please contact the backend.
Unisoc's smartphone chip global market share reached 12% in 2023, increasing by 1 percentage point against the trend.
According to statistics from multiple research institutions, the global smartphone market underwent adjustments in 2023, with shipments estimated to be between 1.14 billion and 1.16 billion units, a year-on-year decline of 4%. However, against the backdrop of the lowest demand in the mobile phone market in a decade, UniSOC's smartphone chip global market share for 2023 reached 12%, increasing by 1 percentage point against the trend, with a growth rate better than the industry's main competitors.
Data shows that UniSOC's market share in the fourth quarter of 2023 reached 13%, with a shipment growth rate of 24%, making it the fastest-growing smartphone chip manufacturer in the open market in terms of year-on-year growth.
In 2023, MediaTek remained the leader in smartphone chips, maintaining the top position in shipments; Apple and Qualcomm ranked second and third, respectively.
Data from Canalys shows that MediaTek achieved a year-on-year growth of 21% in the fourth quarter of 2023, mainly thanks to the increase in shipments of smartphones from Samsung, Xiaomi, and vivo. The shipments of MediaTek Soc products adopted by these three smartphone manufacturers account for half of MediaTek's total smartphone Soc shipments.
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Benefiting from the growth of the smartphone business, MediaTek's revenue in the fourth quarter of 2023 was 129.562 billion New Taiwan dollars, an increase of 17.7% quarter-on-quarter and 19.7% year-on-year. In November 2023, MediaTek officially launched the Dimensity 9300, which was first equipped on the vivo X100 series.
After the launch of the Dimensity 9300, the industry witnessed a "Dimensity 9300 vs Snapdragon 8 Gen 3" battle, with various evaluations comparing the performance of the two Socs. In the Android mobile flagship chip lineup, the performance of the Dimensity 9300 can be described as powerful.
Analysts from the research institution Canalys stated that the recovery of emerging markets led to the rebound of the smartphone market in the second half of 2023, narrowing the global market decline, and the inventory pressure has been significantly reduced. Looking forward to 2024, emerging markets will continue to be a strategic priority for most mobile phone manufacturers seeking growth.In the first half of 2023, Unigroup's smartphone chip global market share reached 15%.
Global market research firm Counterpoint Research previously released a report on the global smartphone AP/SoC market for the second quarter of 2023. The report shows that Unigroup's smartphone chip global market share reached 15% in Q2 2023, making it the fastest-growing chip company in terms of quarterly growth.
According to Counterpoint Research's analysis, Unigroup's shipments achieved rapid growth in the second quarter of 2023. As the penetration rate of entry-level 5G smartphones increased in regions such as Latin America, Southeast Asia, the Middle East and Africa, and Europe, Unigroup also gained a certain market share in these areas.
As a world-leading platform chip design company, Unigroup is committed to providing high-value products and solutions for global customers and partners, making the intelligent world within reach. In the field of 5G, Unigroup has formed a complete chain in technology, products, solutions, terminal applications, and industry layout, and is fully expanding into overseas markets.
Unigroup's CEO, Ren Qiwei: 6G tests semiconductor innovation capabilities
What kind of demand does 6G have for semiconductors, and what challenges does it pose for semiconductor technological innovation? In the keynote speech at the opening of SEMICON CHINA on March 20, Ren Qiwei, Executive Vice President of Unigroup and CEO of Unigroup, said that over the past 40 years, the communication industry and the semiconductor industry have complemented each other. In 2030, six years from now, it not only carries the vision of the semiconductor industry's sales breaking through 100 billion US dollars but also marks the first year of 6G as defined by the ITU (International Telecommunication Union). This indicates that the relationship of mutual promotion and development between communication and semiconductors will continue to exist for a long time.
Before 5G, mobile communication was centered on communication. In the 6G era, communication networks will evolve into mobile information networks, achieving a great integration of communication, perception, computing, artificial intelligence, and the integration of air, land, and space. Ren Qiwei stated that 6G is a mobile information network that integrates perception, computation, and cognition, and integrates the sky and the earth.
Ren Qiwei pointed out that the demand for semiconductor technology in 6G is concentrated in four areas.
First is the process. The continuation of Moore's Law will promote innovation in semiconductor transistor architecture and processes. By expanding functions and integrating functions, the semiconductor industry can "extend Moore." In the future, with technological innovations such as tunnel field-effect transistors and spintronics, the semiconductor industry is expected to "go beyond Moore."Second, the chip architecture. With the improvement of design levels and processes, a single chip will integrate more modules to build more powerful system-on-chip (SoC). Advanced packaging technologies such as SiP (System in Package), Chiplet, and SMT (Surface-Mount Technology) will be further applied, allowing chips to integrate more heterogeneous functional components.
Third, RF components. As the communication frequency rapidly increases with the advent of 6G, the performance of ADC/DAC also needs to be significantly upgraded. Antenna integration and new materials are also important directions for driving the evolution of RF components.
Fourth, memory devices. On the one hand, 6G requires higher-density memory devices, such as high-density storage achieved through 3D stacking like HBM; on the other hand, emerging memory technologies like RRAM and MRAM will also find innovative application spaces in the era of 6G.
*Disclaimer: This article is the original creation of the author. The content of the article represents their personal views. Our reposting is solely for sharing and discussion and does not represent our approval or agreement. If you have any objections, please contact the backend.